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Component tolerance sensitivities of single op-amp filter sections
Editor’s note: This DI invites the reader to reference custom Excel sheets for: Low pass filter, High pass filter, and Bandpass filter design. Please refer to these as you review this DI. —Aalyia...
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Image sensor embeds AI to explore image data
A new generation of CMOS image sensors can exploit all the image data to perceive a scene, understand the situation, and intervene by embedding artificial intelligence (AI) in the sensor. CEA-Leti...
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Elevating embedded systems with I3C
In modern electronics, embedded systems have become increasingly complex, incorporating a variety of sensors and components in many applications including IoT, computing, wearables and...
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Getting positive results from NTC thermistors with a simple passive interface
Given their generally low cost, small size, robust construction, accuracy, versatility, and sensitivity, it’s no wonder that basic negative temperature coefficient (NTC) thermistors rate among the most...
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Synthesis framework simplifies silicon implementation for AI models
Software engineers developing artificial intelligence (AI) models using standard frameworks such as Keras, PyTorch, and TensorFlow are usually not well-equipped to translate those models into...
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Timing module migrates legacy equipment
Microchip’s TimeProvider XT extension system migrates E1, T1, or CC synchronization outputs to a fully redundant TimeProvider 4100 grandmaster. The accessory device allows operators to replace existing...
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GaN power amp delivers 16 W for mMIMO
Mitsubishi will be sampling its MGFS52G38MB GaN power amplifier module (PAM) capable of supplying 16 W of average output power starting this month. The device can be used in 32T32R antenna...
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GaN power packages improve thermal resistance
Fabless semiconductor firm CGD announced two packages for its ICeGaN family of GaN power ICs that enhance thermal performance. Both are variants of the dual-flat no-leads (DFN) package and will debut...
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Multiphase controller meets Intel IMVP 9.2
AOS offers the AOZ71137QI, a 3-rail, 7-phase controller that complies with Intel Mobile Voltage Positioning (IMVP) 8, 9, 9.1, and 9.2 specifications. Together with an AOS power stage, the hybrid...
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Multistandard video switch handles 13.5 Gbps
The PI3WVR41310 four-lane video switch from Diodes supports DisplayPort 2.1 transmission rates at 13.5 Gbps and HDMI 2.1 at 12 Gbps. Its high-speed capability enables increased resolution and refresh...
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Why binary analysis is the cornerstone of robust IoT testing
The Internet of Things (IoT) devices that increasingly permeate our homes, workplaces, and daily lives are only as secure as their most vulnerable components. As the adoption of these connected devices...
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Ultra-low distortion oscillator, part 1: how not to do it.
Editor’s Note: This DI is a two-part series. Part 1 discusses audio oscillators, namely the Wien bridge and biquad, state-variable, or two-integrator-loop configuration. Part 2 will add distortion-free...
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HDL makeover from creation to integration to validation
As system-on-chip (SoC) designs become more complex and powerful, catching potential errors and issues in specifications at the front-end of the design cycle is now far more critical. An EDA outfit...
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Oscilloscope special acquisition modes
Digital oscilloscopes are normally operated in real-time acquisition mode, where the analog input is sampled and digitized at a user-selected sampling rate and written continuously into the acquisition...
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A closer look at Arm’s chiplet game plan
What’s Arm up to in design and development of chiplets, the highly integrated large-scale silicon solutions? The IP giant is gradually unveiling its design blueprint for one of the most exciting...
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I2C active pullup is power thrifty
The popular I2C communication standard manages to perform flexible serial I/O with just a super simple two pin bus: SCL and SDA. It accomplishes this trick with bidirectional timing and data flow....
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The 2024 WWDC: AI stands for Apple Intelligence, you see…
Happy Apple Worldwide Developers Conference (WWDC) week! Unlike many WWDCs that preceded it (but not all, with 2021 an example), this one was absent mention of any new hardware or underlying silicon,...
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System-on-chip (SoC) design is all about IP management
For most system-on-chip (SoC) designs, the most critical task is not RTL coding or even creating the chip architecture. Today, SoCs are designed primarily by assembling various silicon intellectual...
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Industrial sensor unit embeds AI processing
ST’s ISM330BX 6-axis inertial measurement unit (IMU) combines edge AI processing and sensor fusion for industrial vibration sensing and motion tracking. The compact system-in-package contains a 3-axis...
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Isolated probe limits common-mode noise
An isolated probing system, the R&S RT-ZISO measures fast switching signals in environments with high common-mode voltages and currents. Its power-over-fiber architecture galvanically isolates the...
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