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Chipset simplifies DDR5 MRDIMM interfacing
Renesas is sampling a trio of interface ICs for second-generation DDR5 multiplexed rank dual in-line memory modules (MRDIMMs). This complete memory interface chipset includes the RRG50120 multiplexed...
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Thin micro speaker enables sleek designs
Sycamore, a full-range, all-silicon near-field micro speaker from xMEMs, is 1/7th the size and 1/3rd the thickness of conventional dynamic drivers. Coming in at just 8.41×9×1.13 mm and weighing only...
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MCU optimizes satellite control and monitoring
The GR716B radiation-hardened microcontroller from Frontgrade Gaisler handles multiple tasks over extended periods in space. This energy-efficient MCU is well-suited for supervision, monitoring, and...
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Collaboration drives innovation in software-defined vehicles
Siemens is integrating its embedded automotive software with Infineon’s AURIX TC4x MCUs to enable advanced features in software-defined vehicles (SDVs). This collaboration supports OEMs in achieving...
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EDA software uses AI to boost productivity
Keysight’s EDA 2025 software leverages AI, ML, and Python integrations to reduce design time for complex RF and chiplet products. The tool suite enhances data manipulation, integration, and control of...
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Power Tips #135: Control scheme of a bidirectional CLLLC resonant converter...
Introduction A single-stage isolated converter, such as a bidirectional capacitor-inductor-inductor-inductor-capacitor (CLLLC), is a popular converter type in energy storage systems (ESSs) to save...
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Design considerations in high-speed fiber networks
Fiber optic cables play a key role in high-speed network expansion. As wireless and cellular network complexity increases, fiber networks supporting elevated bandwidth, latency and data transmission...
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Earplugs ready? Let’s make some noise!
Usually, noise annoys. Occasionally, it can be a valuable tool. Surprisingly, there is a whole palette of noise colors. This design idea (DI) shows good ways of generating the commonest and most useful...
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Beefing up backup
Further to my prior coverage of this year’s iteration of periodic lightning-damage debacles at my Rocky Mountain foothills residence, I’d earlier mentioned that among the pieces of electronics gear...
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High-side switches offer integrated wire protection
PROFET Wire Guard high-side switches from Infineon provide built-in I2t wire protection for 12-V automotive power distribution. According to the manufacturer, these devices more accurately emulate wire...
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NFC inlays are powered by NXP’s ICODE 3
Identiv’s high-frequency NFC-enabled inlays leverage NXP’s ICODE 3 tag IC, boosting RF performance and read speed. Designed for IoT applications, the ICODE 3 chip includes features suited for...
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LTE Cat 1bis module packs Conexa eSIM
The u-blox SARA-R10001DE LTE Cat 1bis module integrates Wireless Logic’s Conexa embedded SIM (eSIM) for global IoT connectivity. Supporting multi-IMSI technology and eUICC, the eSIM streamlines...
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Smart card IC elevates NFC security
MIFARE DOUX, NXP’s contactless near-field communication (NFC) chip, integrates asymmetric and symmetric cryptography in one IC to simplify key management and distribution. The smart card IC enhances...
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FreeRTOS teams with Infineon AURIX MCUs
Infineon has announced FreeRTOS support for its 32-bit AURIX TC3x family of automotive and industrial microcontrollers. As a key software layer, the RTOS manages both hardware and software resources,...
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0 V to -10 V, 1.5 A LM337 PWM power DAC
As a genre, DACs are low power devices with power and current output capabilities limited to the milliwatt and milliampere range. There is, of course, no fundamental reason they can’t be teamed up with...
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Clapp oscillator
Having already examined the Colpitts oscillator, we now look at its first cousin, the Clapp oscillator. Please consider the following illustration in Figure 1. Figure 1 A Clapp oscillator where the...
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Four tie-ups uncover the emerging AI chip design models
The semiconductor industry is undergoing a major realignment to serve artificial intelligence (AI) and related environments like data centers and high-performance computing (HPC). That’s partly because...
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Wireless fabric-based charging
You’ve likely read or seen video reports of various university research projects which use fabric—usually fashioned into a shirt—as an energy-harvesting arrangement. Some of these use fabrics which...
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IP players prominent in chiplet’s 2024 diary
Chiplets—discrete semiconductor components co-designed and manufactured separately before being integrated into a larger system—are emerging as a groundbreaking approach to addressing many of the...
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Energizer’s PowerSource Pro Battery Generator: Not bad, but you can do better
Back in August, EDN published my coverage of the SLA (sealed lead acid) battery-based Phase2 Energy PowerSource 660Wh 1800-Watt Power Station on sale for $149.99 plus tax at bargains site Meh: I...
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