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Interconnect underdogs steering chiplet design bandwagon
The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California from...
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14-bit scopes boost resolution for general use
The InfiniiVision HD series oscilloscopes from Keysight employ a 14-bit ADC, offering four times the vertical resolution of 12-bit scopes. With a noise floor of 50 µV RMS, they also reduce noise by...
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PCIe 4.0 SSD optimizes system performance
Powered by a Gen 4×4 NVMe controller, the NV3 PCIe 4.0 SSD from Kingston Digital delivers sequential read and write speeds of up to 6000 MB/s and 5000 MB/s, respectively. The drive offers storage...
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Wireless combo module targets embedded devices
KAGA FEI’s WKI611AA1 Wi-Fi 6 and Bluetooth 5.4 combo module simplifies the development of low-power embedded devices. With a built-in antenna and multiple certifications, it reduces antenna development...
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Wideband amplifier meets sub-6 GHz requirements
A wideband RF power amplifier module from Elite RF covers signals from 20 MHz to 6 GHz, delivering a maximum output power of 20 W. Elite RF can also combine these 20-watt amplifiers to create...
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SiC MOSFETs drive automotive architectures
Navitas has released a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAL-7L and TOLL surface-mount packages. Leveraging the company’s trench-assisted planar technology, the Gen-3...
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20MHz VFC with take-back-half charge pump
Way back in 1986, famed analog innovator Jim Williams, in “Designs for High Performance Voltage-to-Frequency Converters” published his “King Kong” 100 MHz VFC. I have never seen its equal. Certainly...
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New UCIe IP raises the chiplet bandwidth bar to 40 Gbps
A new UCIe IP operating at up to 40 Gbps enables more data to travel efficiently across heterogeneous and homogeneous dies—chiplets—in today’s artificial intelligence (AI)-centric data center systems....
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DIY RTD for a DMM
Psychologists tell us that frustration increases drive. I was driven to produce the circuit in this design idea by my increasing frustration with a collection of digital thermometers, all of which...
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It’s September in Apple land, so guess what it’s time for?
A few weeks back, in mid-August to be exact, I pointed out that Google had for the first time in my memory gotten the jump on Apple, pulling in its traditional October launch event by two months in...
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A short design tutorial on Bluetooth Channel Sounding
The highly anticipated Bluetooth 6.0 specification is here, and one of its most notable features is the addition of channel sounding, a two-way ranging technique between two Bluetooth Low Energy (LE)...
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Infineon develops 300-mm GaN technology
Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment. The company notes that 300-mm wafers offer significant technological and efficiency...
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ICs enhance automotive proximity detection
Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of...
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Anechoic chamber tests SATCOM antennas
Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and MEO satellites. Using the Compact Antenna Test Range (CATR) method, the...
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DSP-free PAM4 chipset supports PCIe 6.0
Thine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition in Frankfurt, Germany. By eliminating DSPs from optical communication systems...
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Faraday streamlines chiplet integration
Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging,...
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AI algorithms on MCU demo progress in automated driving
Artificial intelligence (AI) algorithms and supporting hardware will be critical in heralding the next stages of automated and ultimately autonomous driving, and a collaboration between Infineon and ZF...
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How microchannel liquid cooling trims electronic designs
Compact electronics present a unique challenge when it comes to cooling. While thermal management is becoming a growing concern amid increased chip functionality, smaller devices mean there’s less room...
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Switch mode hotwire thermostat
In recent EDN design ideas, we’ve seen thermostat designs that meld the functions of sensor and heater into a single device: FET, BJT, or even a simple length of fine gauge copper wire. A virtue...
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Experimenting with a modern solar cell
For about two decades now, I’ve owned (and occasionally used) an early 24-element solar cell from SunPower. It’s kept my deep cycle secondary “coach” battery topped up through two generations of...
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