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With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half the thickness of typical wafers, which range from 40 µm to 60 µm. This achievement in semiconductor manufacturing technology will increase energy efficiency, power density, and reliability in power conversion for applications such as AI data centers, motor control, and computing.
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Infineon reports that reducing the thickness of a wafer by half lowers the substrate resistance by 50%, resulting in over a 15% reduction in power loss in power systems compared to conventional silicon wafers. For high-end AI server applications, the ultra-thin wafer technology enhances vertical power delivery designs based on vertical trench MOSFETs, enabling a close connection to the AI chip processor. This minimizes power loss and improves overall efficiency.
Infineon’s wafer technology has been qualified and integrated into its smart power stages, which are now being delivered to initial customers. As the ramp-up of ultra-thin wafer technology progresses, Infineon anticipates that it will replace existing conventional wafer technology for low-voltage power converters within the next three to four years.
Infineon will present the first ultra-thin silicon wafer publicly at electronica 2024.
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