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BLE module optimizes power and processing

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A Bluetooth LE module, the EC4L15BA1 from KAGA FEI, offers a built-in antenna and various certifications to reduce development time and certification costs. Equipped with a Nordic nRF54L15 Bluetooth 5.4 SoC, the EC4L15BA1 reduces receive current by almost 50% compared to its predecessor, the EC2832AA2, which employs the nRF53832 Bluetooth 5.2 SoC.

The EC4L15BA1 wireless module features a 128-MHz Arm Cortex-M33 processor, 1.5 MB of nonvolatile memory, and 256 KB of RAM, providing more than double the processing capability of the EC2832AA2. Furthermore, Arm’s PSA Level 3 certification ensures that it meets the highest security needs.

In addition to single-mode Bluetooth 5.4, the multiprotocol module supports Zigbee, Thread, and Matter. It covers a frequency range of 2402 MHz to 2480 MHz, delivering +8 dBm of output power. The EC4L15BA1 operates from a single 1.7-V to 3.6-V power supply over a temperature range of -40°C to +105°C.

According to KAGA FEI, the EC4L15BA1 has obtained Bluetooth qualification and certifications for Radio Law MIC (Japan), FCC (USA), and ISED (Canada).

Samples of the EC4L15BA1 Bluetooth LE module will be available in November 2024. Mass production is scheduled to begin in June 2025.

EC4L15BA1 product page

KAGA FEI 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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